Membership

Hong Kong-Shenzhen Innovation and Technology Park (HSITP) held a topping-out ceremony on 21 March 2025 for Buildings 8 and 9, officiated by Mr John LEE, the Chief Executive of the Hong Kong Special Administrative Region; Mr Michael WONG, Acting Financial Secretary; Professor Sun DONG, Secretary for Innovation, Technology and Industry; and Mr Eddie MAK, Permanent Secretary for Innovation, Technology and Industry and Chairman of Hong Kong-Shenzhen Innovation and Technology Park Limited. The ceremony was attended by over 100 guests who witnessed this milestone moment for HSITP.
 

Following the topping-out of the two wet laboratory buildings in the park, along with the completion of Building 11 in late 2024, the main structural works of the first three buildings at HSITP have been fully completed. This marks the Hong Kong Park of the Shenzhen-Hong Kong Innovation and Technology Co-operation Zone being poised to commence its official operations.
 

At the ceremony, Chief Executive Mr John LEE highlighted the Zone’s role as a “super platform” to leverage Hong Kong’s strengths as a global “super connector” and “super value-adder”. He emphasised the intention to leverage Hong Kong's advantages as an international city and a hub for high-calibre talent to establish the Hetao Co-operation Zone as a bridgehead for innovation and technology (I&T), as well as a showcase and incubator for high-end achievements for the country.